| PART |
Description |
Maker |
| S70WS512N00BAWA30 S70WS512N000BAWA33 |
32M X 16 FLASH 1.8V PROM, 80 ns, PBGA84
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION LLC
|
| LRS1383H |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 8M (X 16) SRAM
|
Sharp Electrionic Components
|
| LRS1380J |
STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM
|
Sharp Electrionic Components
|
| MB84VD22182EE-90-PBS MB84VD22184EE-90-PBS MB84VD22 |
32M (x 8/x16) FLASH MEMORY & 4M (x 8/x16) STATIC RAM
Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM
|
Fujitsu Microelectronics
|
| S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION[SPANSION]
|
| M6MGD137W3 M6MGD137W33TP |
The M6MGD137W33TP is a Stacked micro Multi Chip
Package (S- mMCP) that contents 128M-bit Flash memory
and 32M-bit Mobile RAM in a 52-pin TSOP.
|
RENESAS
|
| K9F5608D0D-PCB00 K9F5608X0D |
32M x 8 Bit NAND Flash Memory
32M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
|
Samsung semiconductor
|
| A82DL3234TG-70 A82DL32X4T A82DL3224 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
|
AMICC[AMIC Technology]
|
| S71PL254 |
STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
|
SPANSION
|
| EN71GL128B0-70CWP |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
Eon Silicon Solution Inc.
|
| S71GL032A80BAI0B2 S71GL032A80BAI0B3 S71GL032A80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
SPANSION[SPANSION]
|
| AM45DL6408G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
